Fairphone 6 leak reveals more modular design
The Fairphone 6 will launch this month with a more modular design according to leaked details obtained by WinFuture. Alongside Fairphone’s usual repair-friendly build, the new device will seemingly support interchangeable accessories such as a card holder, lanyard, and ring grip. That sounds similar to the modular accessories on the CMF Phone 1 and Phone […]
The Fairphone 6 will launch this month with a more modular design according to leaked details obtained by WinFuture. Alongside Fairphone’s usual repair-friendly build, the new device will seemingly support interchangeable accessories such as a card holder, lanyard, and ring grip.
That sounds similar to the modular accessories on the CMF Phone 1 and Phone Pro 2 by Nothing, which support screw-on lanyards, wallets, and kickstands. WinFuture reports that the Fairphone 6 will also have a two-part rear cover split into upper and lower sections, allowing owners to mix and match colors along with the accessories, with black, white, and green among the launch options.
Dutch site NieuweMobiel reports that the phone will launch on June 25th, and offer 8GB of RAM and 256GB of storage. Much like previous Fairphone models, it will be user-repairable, with replacement parts available for the earpiece, speaker, USB-C port, display, battery, and three camera lenses. When it arrives, it’s expected to cost €549.99 (around $625), a substantial drop from 2023’s €699 ($800) Fairphone 5. That phone never launched in the US, so we’ll have to hope that changes this time around.
