SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana — for HBM and other exotic memory types
SK hynix plans to build a $4 billion chip packaging facility in Indiana, which could begin operations in 2029, according to a WSJ report. If the plant gets the green light, likely with tax incentives, it would focus on advanced packaging like that used for HBM3e and future HBM solutions.
SK hynix plans to build a $4 billion chip packaging facility in Indiana, which could begin operations in 2029, according to a WSJ report. If the plant gets the green light, likely with tax incentives, it would focus on advanced packaging like that used for HBM3e and future HBM solutions.
