TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models
TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.
TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.
